IEC and ISO SMART Standard Digitalization Lead Visits China — International Cooperation in Standard Digitalization Deepens From June 8 to 9, 2026, Francis Pennell, Head of the SMART Standards Single Delivery Unit (SDU) of the International Electrotechnical Commission (IEC) and the International Organization for Standardization (ISO), visited the China National Institute of Standardization (CNIS). The two sides held in-depth discussions over two days on topics related to standard digitalization. 17 Jun, 2026
IEC SC8D Secretariat Established in Beijing — Filling the International Standardization Gap in the Intersection of Electric Power and Meteorology On June 10, 2026, the inaugural meeting of the Secretariat of IEC Subcommittee 8D "Meteorological Services and Technologies for Electric Power Systems" (IEC SC8D) and the Electric Power Meteorology Technology Symposium were held in Beijing, marking the official establishment of the secretariat in China. 17 Jun, 2026
Canada joins international effort to shape responsible AI standards SCC signs arrangement with standards bodies from Singapore, the United Kingdom, Republic of Korea, and Australia to support practical work on AI governance, testing, and international standards. 17 Jun, 2026
DIN and Sovereign Tech Agency Sign MOU on Open Source Standardization Open Source Community and International Standards Bodies Join Forces for the First Time BERLIN — In June 2026, the German Institute for Standardization (DIN) and the Sovereign Tech Agency signed a Memorandum of Understanding to establish a partnership aimed at systematically integrating the practical experience of open source maintainers into international standards development. This marks the first institutionalized collaboration between the open source community and international standards bod 16 Jun, 2026
ETSI releases Standard on Securing AI Computing Platforms ETSI is pleased to announce the release of a new technical specification defining security requirements for Artificial Intelligence (AI) computing platforms. The ETSI TS 104 033 specification provides a systematic security baseline for the computing platforms that host AI model training and inference. 12 Jun, 2026
ETSI standards make Digital Wallets work for 450 million Europeans Imagine being able to prove who you are online, sign documents, or share your qualifications all from one secure digital wallet on your phone? This is what the European Digital Identity Wallet (EUDIW) will offer to 450 million citizens in the European Union. 11 Jun, 2026
Open Call for Tender: Experts for the development of a Pan-European Certificate on Standardization of the RESSE Project - Reinforcing the European Standardization System through Education The three European Standardization Organizations – CEN, CENELEC and ETSI – have created a consortium to respond to a call under the Single Market Programme aimed at Reinforcing the European Standardization System through Education (RESSE) and addressing the need for skilled experts in standardization. 01 Jun, 2026
CEN and CENELEC Publish Six Standards on Digital Product Passports On 27 May 2026, the Joint Technical Committee CEN/CLC/JTC 24 on Digital Product Passports – Framework and Systems, under the European Committee for Standardization (CEN) and the European Committee for Electrotechnical Standardization (CENELEC), officially published six standards on Digital Product Passports (DPP). 27 May, 2026
Serving national strategies and industry demands to promote deep integration of industry, academia, and research. Shenzhen University of Technology: Exploring a paradigm shift in university research for the future At the critical juncture of the end of the 14th Five Year Plan and the beginning of the 15th Five Year Plan, Shenzhen University of Technology, as an important participant in the innovative development of higher education in the Guangdong Hong Kong Macao Greater Bay Area, has continued to make efforts in breaking down traditional disciplinary barriers, exploring the transformation of scientific research paradigms, and promoting the deep integration of industry, academia, and research through the 28 Sep, 2025
The 2025 Shenzhen Brain Expo kicks off, and the Greater Bay Area Brain Science and Central Nervous Disease AI Innovation Alliance is established The "2025 Shenzhen Brain Expo" is jointly organized by the Shenzhen Brain Science Society, the Science and Technology Transformation and Innovation Working Committee of the Chinese Neuroscience Society, the Shenzhen Hong Kong Brain Science Innovation Research Institute, Shenzhen University of Technology, the Shenzhen Brain Science Technology Industry Innovation Center, and the Brain Analysis and Brain Simulation Major Science and Technology Infrastructure. The conference will last for three days 28 Sep, 2025

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